Laser system for PCB and Micro-processing – DCT S2
Features:
For micro processing variety of material including LTCC/HTCC drilling FPC depaneling thin and tough PCBs (including assembled PCBs) contour cutting coverlayer cutting decap of rigid-flex PCBs cutting complex shapes direct structuring conductive pattern ablating solder resistremoving additional line drilling of ceramics through holes or blind vias drilling on FPC
Consisting of:
- Nano-second laser
- Granite X/Y table
- Visionsystem with high resolution camera and reflectance light resource
- Camera supported positioning system with fiducial recognition
- X/Y axises driven by Linear motor
- Industrial control PC display keyboard and mouse
- Water-cooling unit
- Vacuum table for material
- Machine driven software: DreamCreTor 3
- Data processing software: CircuitCAM 7 Standard
- Double safty light curtain
- Working area (X x Yx Z): 300 mm × 350 mm x 10mm
- Accuracy of repeatability: ±2 μm
- Laser wavelength: 355 nm
- Average output of laser: 15W
- Digital scanning galvanometer
- TelecentricLense
- Resolution of galvanometer: 1 μm
- Travelling resolution of X/Y/Z Axis: 1 μm
- Weight: approx. 750 kg
- Machine Hood dimensions (L/W/H): 1210 mm × 920 mm × 1630 mm
Operating conditions:
- Power supply: 400/16A or 230V/32A 50 Hz
- Main power: 3 kW
- Peripherals power: 1.5 kW
- Ambient temperature 22° C ± 2° C
- Ambient Humidity: <60%
- Dry and clean compressed air is required!
- Input pressure: 6-8bar air throughput: > 120L/min